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MK01

MK01

$8.00

Features:

  • Nordic® Semiconductor nRF52832 SoC solution
  • Bluetooth 5 (2Mbps CSA#2 Advertising Extensions)
  • 512kB Flash and 64kB RAM
  • Wide supply voltage range: 1.7 V to 3.6 V
  • Full set of digital interfaces including SPI/2-wire/I²S/UART/PDM/QDEC
  • NFC-A Tag
  • Dimension: 10.0×10.0×2.0mm (with shield)
  • 22 GPIOs
  • Antenna (MK01A – Ceramic chip antenna MK01B – u.FL connector)
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Description

MK01 series is a powerful, highly flexible, ultra-low power Bluetooth® 5 module based on Nordic® Semiconductor nRF52832 SoC solution, which has a 32 bit Arm® Cortex™-M4 CPU with floating point unit running at 64MHz.

MK01 smallest Bluetooth module has an ultra-small size of 10mm x 10mm with 28 LGA (Land Grid Array) 0.4mm x 0.4mm pad pins providing 22 GPIOs (including 32.768 kHz crystal and reset pins) of nRF52832CIAA (WLCSP package).

MK01 series Bluetooth module has two different models — MK01A & MK01B.

Specification

Dimension 10.0x10.0x2.0mm(with shield)
Flash/RAM 512KB/64KB
Interface UART, SPI, TWI, PDM, I2S, QDEC, PWM, ADC, NFC
Power Supply 1.7-3.6 V
Operating temp -40 to +85°C
BLE5.0/5.1 Specification 2 Mbps, CSA #2, Advertising Extensions
Cover Metal shielding with marking
BLE Standard BLE 5.1
GPIOs 22
Antenna Type Ceramic Chip/u.FL Connector
32.768K Crystal Oscillator Built inside
Pad package Land Grid Array (LGA)
Other Feature Bluetooth mesh, ANT+, 2.4GHz

Description

MK01 series is a powerful, highly flexible, ultra-low power Bluetooth® 5 module based on Nordic® Semiconductor nRF52832 SoC solution, which has a 32 bit Arm® Cortex™-M4 CPU with floating point unit running at 64MHz.

MK01 smallest Bluetooth module has an ultra-small size of 10mm x 10mm with 28 LGA (Land Grid Array) 0.4mm x 0.4mm pad pins providing 22 GPIOs (including 32.768 kHz crystal and reset pins) of nRF52832CIAA (WLCSP package).

MK01 series Bluetooth module has two different models — MK01A & MK01B.

Specification

Dimension 10.0x10.0x2.0mm(with shield)
Flash/RAM 512KB/64KB
Interface UART, SPI, TWI, PDM, I2S, QDEC, PWM, ADC, NFC
Power Supply 1.7-3.6 V
Operating temp -40 to +85°C
BLE5.0/5.1 Specification 2 Mbps, CSA #2, Advertising Extensions
Cover Metal shielding with marking
BLE Standard BLE 5.1
GPIOs 22
Antenna Type Ceramic Chip/u.FL Connector
32.768K Crystal Oscillator Built inside
Pad package Land Grid Array (LGA)
Other Feature Bluetooth mesh, ANT+, 2.4GHz

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